Board Thickness * Millimeters (mm)

Drill Diameter * Millimeters (mm)

Pad Diameter * Millimeters (mm)

Annular Ring (min) Millimeters (mm)

Minimum Trace Width Millimeters (mm)

Copper Weight Ounces per square foot

1.6mm board, 0.3mm drill, 0.6mm pad 1.2mm board, 0.2mm drill, 0.45mm pad

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Via specifications

Standard

Pad Drill

— —

Via cross-section

Aspect Ratio—

Annular Ring—

Board Thickness—

Copper Weight—

Aspect ratio — : — (Recommended: ≤ 10:1 for standard vias, ≤ 6:1 for microvias)

Heat to Dissipate * Watts (W)

Temperature Difference * Degrees Celsius (°C)

Board Thickness * Millimeters (mm)

Copper Weight Ounces per square foot

1W, 20°C rise, 1.6mm board 2W, 25°C rise, 1.6mm board, 2oz

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Thermal via requirements

Thermal

Recommended via diameter: — mm, — vias needed for —W dissipation.

Current * Amperes (A)

Temperature Rise * Degrees Celsius (°C)

Board Thickness * Millimeters (mm)

Copper Weight Ounces per square foot

1A, 10°C rise 2A, 15°C rise, 2oz 0.5A, 10°C rise

— mm

Required via diameter

Current

Via diameter — mm for —A with —°C rise. Current density: — A/mm².